摘要 |
<p>PROBLEM TO BE SOLVED: To provide a carrier for testing a non-packaged chip, applicable to the automation of mass-production of known good dies. SOLUTION: This carrier 200 for testing a non-packaged chip 110 includes a drum part 120 having a chip containing space 128 for containing the chip 110 recessed in one surface 126, a connection terminal formed on a bottom surface of the chip containing space 128 and comprising an inner connection terminal 138 to be connected to an electrode pad 112 of the chip 110 and an outer connection terminal connected to the inner connection terminal 138 and protruded outside the drum part 120, and a fixing means for holding the chip 110 in the chip containing space 128, and vertical and lateral sizes of the outer connection terminal and the drum part 120 are set in such a way that they can be inserted into a test socket to be connected.</p> |