发明名称 |
Method for arranging minute metallic balls |
摘要 |
A method for arranging metallic balls to form an array of bump electrodes comprises the steps of immersing a silicon template in ethanol dropping metallic balls through the ethanol onto the template to receive the metallic balls in the holes of the template. The metallic balls are free from cohesion caused by electrostatic charge or moisture. The template may be inclined in the ethanol. The holes are formed by anisotropic etching a silicon plate.
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申请公布号 |
US5976965(A) |
申请公布日期 |
1999.11.02 |
申请号 |
US19980098528 |
申请日期 |
1998.06.17 |
申请人 |
NEC CORPORATION |
发明人 |
TAKAHASHI, NOBUAKI;SENBA, NAOJI;SHIMADA, YUZO |
分类号 |
H01L21/60;H01L21/48;H01L23/12;H05K3/34;(IPC1-7):H01L21/607 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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