发明名称 Method for arranging minute metallic balls
摘要 A method for arranging metallic balls to form an array of bump electrodes comprises the steps of immersing a silicon template in ethanol dropping metallic balls through the ethanol onto the template to receive the metallic balls in the holes of the template. The metallic balls are free from cohesion caused by electrostatic charge or moisture. The template may be inclined in the ethanol. The holes are formed by anisotropic etching a silicon plate.
申请公布号 US5976965(A) 申请公布日期 1999.11.02
申请号 US19980098528 申请日期 1998.06.17
申请人 NEC CORPORATION 发明人 TAKAHASHI, NOBUAKI;SENBA, NAOJI;SHIMADA, YUZO
分类号 H01L21/60;H01L21/48;H01L23/12;H05K3/34;(IPC1-7):H01L21/607 主分类号 H01L21/60
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