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发明名称
METAL MOLD FOR CHAMFERING LEADFRAME PAD
摘要
申请公布号
KR200160429(Y1)
申请公布日期
1999.11.01
申请号
KR19970021283U
申请日期
1997.08.01
申请人
SAMSUNG TECHWIN CO.,LTD.
发明人
LEE, YOUNG-GI
分类号
H01L23/495;(IPC1-7):H01L23/495
主分类号
H01L23/495
代理机构
代理人
主权项
地址
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