| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC card easy to manufacture, improved in productivity and coping with both systems of a contact type and a non-contact type by obtaining high inductance. SOLUTION: A module substrate 6 where a contact terminal 8 and a land 7 are formed, an IC chip 5 connected to the land 7 for coping with both systems of the contact type and the non-contact type and a winding wire coil 3 connected to the land 7 are installed on a card base body 4. Since the winding wire coil 3 is connected on the module substrate 6 where the contact terminal 8 is formed, an existing contact type module substrate is used. Also, since the entire card area excluding an IC module 2 is used for a space for housing the winding wire coil 3, a wire diameter and a winding number or the shape of the winding wire coil 3 itself is freely changed corresponding to the use of the inductance and the high inductance is obtained. |
