| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed circuit, wherein a short circuit caused by expansion of a conductive adhesive agent film formed on a circuit formed by printing is prevented. SOLUTION: A terminal 2 of an Ag circuit formed on a substrate by printing and a conductive adhesive agent film 1 are connected with an overlap of width W. The conductive adhesive agent film 1 comprises such form as extends in the direction where the terminal 2 extends. Related to the conductive adhesive agent film 1, a bottleneck part 1a is formed at a position where the lead of a mounting part such as QFP(quad flat package) is fitted. In the longitudinal direction of the conductive adhesive agent film 1, the bottleneck part la is formed over, for example, 0.3-0.5 mm while, for example, about 0.10-0.25 mm as bottleneck degree at the narrowest position, on one side. The distance from the narrowest position to the tip end on the terminal 2 side is A. W<=(2/3)×A is established for overlap width W and distance A.
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