| 摘要 |
A tool is provided for polishing, planarizing, cleaning or otherwise processing silicon wafers or other workpieces. It comprises a cylindrical roller mounted on a spindle above a platform or workstation on which a wafer is mounted. The roller is movable into and out of contact with the wafer, and is rotatable to polish the wafer. The wafer may also be rotatable and translatable on the platform. The roller has a linear region of contact with the wafer during processing operations.
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