SEMICONDUCTOR DEVICE AND ITS MANUFACTURE

摘要

PROBLEM TO BE SOLVED: To obtain a semiconductor device which can fill a part between a package substrate and a lead frame with resin for encapsulation, and makes the device of high reliability and moreover high performance. SOLUTION: In this semiconductor device, a sticking part 1a in a lead frame 1 for manufacturing process is stuck to a package substrate 2 through the use of an adhesive agent, and a semiconductor chip set on a package substrate 2 and the sticking part 1a in the lead frame 1 are encapsulated with resin for encapsulation. The width of a lead 1b attached to the sticking part 1a is set at most 80% of the maximum film thickness of the lead 1b.