| 摘要 |
PROBLEM TO BE SOLVED: To easily manufacture a resin encapsulated semiconductor device with small pitches and many pins, while keeping the high reliability of a resin package. SOLUTION: In this manufacturing method, outer leads 5 of a lead frame 1 are coupled to each other with resin tie-bars 8, and a semiconductor chip is then mounted on a die pad 3 and encapsulated with a resin package. Next, the device is immersed in an electrolyte and energized for a specified time using the lead frame 1 and the opposite pole as a cathode and an anode, respectively, and then taken out of the electrolyte, and jet water flow is applied to the resin tie-bars 8 to remove it. At this time, first the jet water flow is applied, while moving it along the end of the side opposite to the package side of the resin tie-bar 8. A residue which is left while removing the resin tie-bar 8 is moved to the resin package side through pressure due to the jet water flow. Next, the jet water flow is applied, while moving it along the end of the resin package side to remove the residue together with the burrs of the package. |
