发明名称 METHOD AND DEVICE FOR MANUFACTURING COMPOUND SEMICONDUCTOR THIN FILM
摘要 <p>PROBLEM TO BE SOLVED: To provide a product of which composition control is easy and making film repeatability is superior, by supplying a first family element and a third family element from a sputtering target, and by supplying a fourth family element from an evaporating source selected from Se and S and made of more than one kind. SOLUTION: Three target equipping devices 1a, 1b and 1c are equipped with each Cu target 31, Cu/Ga target 32 and In target 33 in order as sputtering targets. A melting pot 2 is equipped with Se 34 as an evaporating source. A glass substrate as a substrate on which an Mo film is formed is assembled on a substrate holder. While predetermined electric powers are impressed to the three sputtering targets from each electric power source, each target of Cu 31, Cu/Ga 32 and In 33 is made sputtering. The Se evaporating source 34 is heated over a temperature higher than the Se boiling point by a heater. A composition ratio of each element during film making is regulated by a power which is impressed to each target.</p>
申请公布号 JPH11260724(A) 申请公布日期 1999.09.24
申请号 JP19980065201 申请日期 1998.03.16
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 INOUE HIRONOBU;YAMANISHI HITOSHI;YOKOYAMA MASAHIDE;NEGAMI TAKAYUKI;WADA TAKAHIRO
分类号 H01L31/04;C23C14/24;C23C14/34;H01L21/203 主分类号 H01L31/04
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