ELECTRIC POTENTIAL SHAPING APPARATUS FOR HOLDING A SEMICONDUCTOR WAFER DURING ELECTROPLATING

摘要

Apparatus for treating the surface of a substrate, the apparatus comprising a clamshell (32) mounted on a rotatable spindle (40). The clamshell comprises a cone (34), a cup (36) and a flange (48). The flange (48) has apertures (50) which are adjacent the substrate or wafer (38) allowing gas bubbles entrapped on the substrate surface to readily escape.