A metallization structure is fabricated by depositing an underlayer of a group IVA metal having a thickness of about 90 to about 110 angstroms, and depositing a layer of aluminum and/or an aluminum alloy. The metallization structure obtained exhibits enhanced electromigration and is highly textured and is especially suitable for forming electrical connections or wiring.
申请公布号
US5943601(A)
申请公布日期
1999.08.24
申请号
US19970846382
申请日期
1997.04.30
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人
USUI, TAKAMASA;DEHAVEN, PATRICK W.;RODBELL, KENNETH P.;FILIPPI, RONALD G.;YANG, CHI-HUA;KATATA, TOMIO;AOCHI, HIDEAKI