| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayered printed wiring board, wherein inner boards are restrained from slipping, even if the inner boards are laminated and subjected to thermocompression molding, and the inner boards can be easily and accurately aligned. SOLUTION: A multilayered printed wiring board is manufactured through a method, where inner boards 2 are almainted interposing prepregs 1 between them, and a prepreg 1 and an outer copper foil are laid on both the sides of the laminated inner boards 2 and subjected to thermocompression forming, the inner boards 2 where fixing pin holes are bored and the prepregs 1 of a forming size where fixing pin holes are bored corresponding to surface-bonding are provided to a fixing a jig 7 where fixing pins 8 are provided upright, reference eyelet holes 3 are bored in the prepregs 1 and the inner boards 2, and eyelets 6 are press-fitted into the reference holes 3 bored in both the prepregs 1 and the inner boards 2 to caulk the inner boards 2 and the prepregs 1. |
