发明名称 |
Die architecture accommodating high-speed semiconductor devices |
摘要 |
In a semiconductor memory device, a die architecture is provided that arranges memory arrays into a long, narrow configuration. Bond pads may then be placed along a long side of a correspondingly shaped die. As a result, this architecture is compatible with short lead frame "fingers" for use with wide data busses as part of high speed, multiple band memory integrated circuits.
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申请公布号 |
US5936877(A) |
申请公布日期 |
1999.08.10 |
申请号 |
US19980023254 |
申请日期 |
1998.02.13 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
MORGAN, DONALD M.;MERRITT, TODD A. |
分类号 |
G11C5/02;H01L27/108;(IPC1-7):G11C5/02 |
主分类号 |
G11C5/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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