| 摘要 |
<p>PROBLEM TO BE SOLVED: To surely measure soldering strength without injury to a semiconductor device or a lead terminal in the case of testing the tensile strength of the semiconductor device. SOLUTION: In the case of testing the tensile strength of a semiconductor device, a semiconductor element 2 having a support plate 1 and a main surface 2a stuck to the support plate 1 with solder 3, and the semiconductor device 6 having a lead terminal 4 stuck to the other main surface 2b of the semiconductor element 2 with solder 5 are arranged on a support base 11, and the support base 11 is heated by a heating unit 18 to soften the solders 3, 5 of the semiconductor device 6. Since a tension force is applied to the solders 3, 5 softened by heating the semiconductor device 6, the solders 3, 5 are separated or broken before the lead terminal 4 or the semiconductor element 2 is ruptured or broken.</p> |
