| 摘要 |
The method of fabricating a capacitor of a memory cell is disclosed including the steps of forming a transistor on a semiconductor substrate; sequentially forming an etch stop layer, an insulating layer and a first conductive layer on the semiconductor substrate and the transistor; converting a portion of the first conductive layer into a first porous layer through anodization; patterning a predetermined portion of the first porous layer to form a storage node contact; forming a second conductive layer on the semiconductor substrate and the first porous layer; converting a portion of the second conductive layer into a second porous layer through anodization; patterning a portion of the second porous layer and forming a storage node electrode pattern through an etching process; forming a dielectric layer on an overall surface of the storage node electrode pattern; and forming a third conductive layer on an overall surface of the dielectric layer.
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