| 摘要 |
<p>PROBLEM TO BE SOLVED: To execute metal embedment into microgrooves patterned and formed on a wafer substrate without gaps with high reliability by disposing a cooling device for a plating liquid and a device for heating the substrate from the surface on the side opposite to a plating surface. SOLUTION: A substrate 2 is held at a holding member 12 and the temp. of, for example, the rear surface of the substrate is kept at 95 deg.C by heating the substrate 2 from a rear surface side by a heater 14. On the other hand, a pump 74 and the cooling device 69 are operated to cool the plating liquid 9 and to circulate and supply the liquid to a plating vessel 1 where the temp. of the plating liquid is kept at, for example, 7 deg.C. As a result, the mechanism to heat the plating liquid 9 through the substrate 2 is obtd. The substrate 2 is, therefore, higher in temp. at all times than the plating liquid 9 and the temp. gradient at which the temp. is high on the rear surface side and low on the front surface side is formed within the substrate 2. Consequently, the electroless plating has particularly high dependence on the temp. and, therefore, the plating grows preferentially on a base part side even at the inside walls of the microgrooves formed on the substrate. The metal packing free of the gaps is thus executed.</p> |
