发明名称 Integrated electronic circuit
摘要 An electronic integrated circuit which includes at least one of RF, microwave, digital and analog components connected in a desired circuit. The integrated circuit includes a substrate of a conductive material having on a surface thereof a body of a dielectric material. The dielectric body is formed of a plurality of layers of the dielectric material bonded together. A plurality of strips of a conductive material are on the surfaces of the layers of the body to form RF, analog and digital components. Discrete electronic devices are mounted on the body and connected in the circuit. Vias of a conductive material extend through the various layers of the body to electrically connect the various strips of conductive material on the layers of the body.
申请公布号 US5929510(A) 申请公布日期 1999.07.27
申请号 US19970960663 申请日期 1997.10.30
申请人 SARNOFF CORPORATION;SHARP KABUSHIKI KAISHA 发明人 GELLER, BERNARD DOV;FATHY, ALY E.;PERLOW, STEWART M.;PRABHU, ASHOK NARYAN;TORMEY, ELLEN SCHWARTZ;PENDRICK, VALERIE ANN;KALISH, ISRAEL HAIM
分类号 H01L25/18;H01L23/34;H01L23/66;H01L25/04;(IPC1-7):H01L29/40;H01P1/15;H05K1/00 主分类号 H01L25/18
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