发明名称 |
Pattern formation method and substrate manufacturing apparatus |
摘要 |
<p>Provided is a substrate manufacturing technique for forming patterns on substrates with the aid of an ink-jet systems. Relates to a substrate manufacturing apparatus for forming arbitrary patterns on a substrate 1 from a fluid 11. This apparatus comprises an ink-jet print head 2 configured to allow the fluid 11 to be ejected onto the substrate 1; treatment means 3 for performing a specific treatment on the substrate 1; drive means 4 configured to allow the relative positions of the ink-jet print head 2, the treatment means 3, and the substrate 1 to be varied; and control means 5 for controlling the ejection of the fluid 11 from the ink-jet print head 2, the treatment performed by the treatment means 3, and the drive effected by the drive means 4. The control means 5 is configured to allow the treatment by the treatment means to be performed prior to the ejection of fluid from the ink-jet print head 2. <IMAGE></p> |
申请公布号 |
EP0930641(A2) |
申请公布日期 |
1999.07.21 |
申请号 |
EP19990100893 |
申请日期 |
1999.01.19 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
KIGUCHI, HIROSHI;FUKUSHIMA, HITOSHI;NEBASHI, SATOSHI;SHIMODA, TATSUYA |
分类号 |
B41J2/01;H01L21/00;H01L21/3205;H01L21/768;H01L51/00;H01L51/40;H05K3/12;(IPC1-7):H01L21/00 |
主分类号 |
B41J2/01 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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