| 摘要 |
PROBLEM TO BE SOLVED: To provide a plasma device capable of lowering a downtime of treatment in the device and increasing an efficiency of wafer transferring. SOLUTION: This plasma device conducting a plasma treatment on a wafer comprises a supplying stage 2 holding carrier, a buffer device 4 temporarily storing the wafer, a reacting chamber 6 conducting plasma treatment on the wafer, a first transferring arm 3 located between the supplying stage 2 and the buffer device 4, and a second transferring arm 5 located between the buffer device 4 and the reacting chamber 6. The buffer device 4 comprises a pair of boat units 41 respectively receiving wafers and rotatable around an vertical axis located in the middle between the boat units. One boat unit 41 of the buffer device 4, the second transferring arm 5, and at least one opening of the reactive chamber 6 are contained in a load lock chamber 7 subject to decompression. |
