Hybridschaltung mit einem System zur Wärmeableitung

摘要

A least one of the connecting pins (5) to solder the hybrid circuit (1) on a printed board is fitted with a heat transition resistance to the hybrid circuit (1), which is enlarged in relation to the other connecting pins (2) in such a way that said connecting pin (5) does not reach the melting temperature of the solder used at a given power level.