HIGH INTEGRITY BORDERLESS VIAS WITH HSQ GAP FILLED PATTERNED CONDUCTIVE LAYERS

摘要

Borderless vias (55) are formed in electrical connection with a lower metal feature of a metal pattern gap filled with HSQ (52). Heat treatment in an inert atmosphere is conducted before filling the through-hole to outgas water absorbed during solvent cleaning of the through-hole, thereby reducing via void formation and improving via integrity.