发明名称 ADHESIVE POLYIMIDE FILM
摘要 PROBLEM TO BE SOLVED: To obtain an adhesive polyimide film of which deffectives (burr) occurring in a punching step is greatly reduced by specifying the thicknesses of the core layer and adhesive layers of an adhesive film comprising a core layer and adhesive layers formed on both sides of the core layer. SOLUTION: The thickness of the core layer is adjusted to be 55-90μm, pref. 60-80μm, still pref. 65-75μm. The thickness of the adhesive layer is 5-25μm, pref. 10-20μm, still pref. 12.5-17.5μm. Pref., the core layer comprises a polyimide contg. structural units represented by formula l (wherein R1 is a group represented by formula II or III; and R2 is a divalent org. group) and having an elastic modulus of 400 kgf/mm<2> or higher and a water absorption of 1.5% or lower. Pref., the adhesive layer contains structural units represented by formula IV (wherein R3 is a group represented by formula V or VI; and R4 is a divalent org. group) and has a water absorption of 1.0% or lower and a glass transition temp. of 300 deg.C or lower.
申请公布号 JPH11166162(A) 申请公布日期 1999.06.22
申请号 JP19970332994 申请日期 1997.12.03
申请人 KANEGAFUCHI CHEM IND CO LTD 发明人 TANAKA SHIGERU;HOSOKAWA YOICHI;FURUYA HIROYUKI
分类号 C08J5/12;B32B27/34;C09J7/02;C09J179/08;H05K1/03;H05K3/38;(IPC1-7):C09J7/02 主分类号 C08J5/12
代理机构 代理人
主权项
地址
您可能感兴趣的专利