| 摘要 |
PROBLEM TO BE SOLVED: To suppress warping and provide excellent heat resistance in a multilayer wiring board, wherein high density wiring is made possible by using a non-through hole for connecting the circuits between the insulating layers. SOLUTION: On an upper and a lower lanes of a core material printed board 1 (glass woven fabric epoxy), an aramid nonwoven fabric prepreg impregnated with epoxy resin is stacked, copper foils are stacked on the top and bottom of the workpiece, and a copper-placed laminate board is formed by applying heat and pressure. The copper foil on the part whereupon a non-through hole is to be formed is removed by etching, the non-through hole is made with laser beams on such part, and a circuit 3 and the circuit of the core material printed board 1 are connected by the non-through hole 4 of an insulating layer 10. Such multilayer manufacturing process is repeated in the same manner in the case of increasing the number of layers. The circuit of each layer is connected with a through hole 5 as needed. |
