METHOD AND STRUCTURE FOR MOUNTING OF ELECTRONIC COMPONENT WITH BUMP

摘要

PROBLEM TO BE SOLVED: To enhance the reliability of mounting by relaxing thermal stress due to thermal cycling. SOLUTION: In the mounting structure of an electronic component with a bump which is formed by jointing a bump 14 of an electronic component 13 with a bump on an electrode 12 of a substrate 11 and injecting underfill resin 15 between the substrate 11 and the electronic component 13 with a bump, the substrate 11 is formed in a two-layer structure of an upper substrate 11A, wherein the electrode 12 is formed and a lower substrate 11B. Linear expansion coefficient of the underfill resin 15 is made larger than that of the electronic component 13 and a material of the upper substrate 11A is provided with a linear expansion coefficient which is larger than that of the underfill resin 15. Thereby, it is possible to effectively relax repetitive thermal stresses generated by heat cycle and to enhance the reliability after mounting by preventing breaking.