| 摘要 |
<p>A method of laser marking substrates such as glass, ceramic, metal and plastic is disclosed. A marking material is applied to the surface of the substrate, followed by removal of a portion of the marking material with a laser. The remaining portion of the marking material is then adhered to the substrate by heating or the like. The marking material may comprise a marking component such as glass frit or precursors thereof, inorganic pigments or precursors thereof, silicates, metal oxides, sulfides, nitrides and carbides, organometallic materials or metal powders. In addition to the marking component, the marking material preferably includes a removable medium which facilitates removal of the material from the substrate upon laser irradiation. The marking method is highly versatile, can be performed quickly, and produces permanent marks of high resolution and contrast with minimal or no damage to the substrate.</p> |
