| 摘要 |
PROBLEM TO BE SOLVED: To obtain stable connection by reducing an inductance between a solder ball of an integrated circuit and an electrode of a circuit board and by sufficiently absorbing a high coplanarity, to simplifying the structure to be suitable for mass production, and to reduce the outside dimensions. SOLUTION: On a flexible substrate 10 composed of a sheet of insulative plate material having flexibility, a plurality of movable pieces 11 corresponding to a plurality of solder balls 101 of an integrated circuit 100, with their three sides cut by slits 14 are formed in the cantilever constitution, and a contact plate 1 which forms electrode layers 12 electrically connected between the both sides of the movable pieces 11 is installed on each both sides of the movable pieces 11. Spacers 2 which hold the contact plates 1 with a prescribed interval for the surface of the circuit board 200 are installed. Each of the plural solder balls 101 is pressed against one of the electrode layers 12 of a plurality of the movable pieces 11 to curve the movable pieces 11, and a positioning frame 3, pressurizing springs 4, mounting screws 5, etc., are installed to press the electrode layer 12 of the other side of the movable piece 11 against the corresponding electrode 201. |
