发明名称 |
Electrode reshaping in a semiconductor etching device |
摘要 |
An electrode reshaping process and apparatus is provided for use in a semiconductor etching device. A wafer is place between upper and lower electrodes of the semiconductor etching device. The apparatus and method selectively adjusts the shape of an upper electrode in the semiconductor etching device to compensate for non-uniformities inherent in the etching device. One or more motors attached to the upper electrode provide the electrode shaping forces in accordance with information provided by etch rate variation models stored in a host computer. With the shape of the upper electrode adjusted, the wafer can be etched more uniformally.
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申请公布号 |
US5904487(A) |
申请公布日期 |
1999.05.18 |
申请号 |
US19960731028 |
申请日期 |
1996.10.08 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
CONBOY, MICHAEL R.;COSS, JR., ELFIDO |
分类号 |
G01N19/08;(IPC1-7):G01N19/08 |
主分类号 |
G01N19/08 |
代理机构 |
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地址 |
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