Verbindungsverfahren und Anordnung zur elektrischen Verbindung kleiner Teile
摘要
A first portion (20) is set near or in contact with a second portion (21). The first and second portions (20, 21) are electrically connected by spraying fine metal particles (15) on the first and second portions (20, 21) to form a metal bump (24). <IMAGE>
申请公布号
DE69131068(D1)
申请公布日期
1999.05.06
申请号
DE1991631068
申请日期
1991.12.31
申请人
KABUSHIKI KAISHA TOSHIBA, KAWASAKI, KANAGAWA, JP
发明人
OKUMURA, KATSUYA, C/O INTELLECTUAL PROPERTY DIV., MINATO-KU, TOKYO 105, JP