| 摘要 |
<p>PROBLEM TO BE SOLVED: To mount a semiconductor chip on a transparent substrate by, while a part between the semiconductor chip and the transparent substrate being hollow, comprising an insulating member applied into other part. SOLUTION: A hollow part 13 is formed between a part of a microlens group 3 of a semiconductor chip 1 and a transparent substrate 7. A ultraviolet thermosetting resin 12 is so formed as to enclose the hollow part 13. The ultraviolet thermosetting resin 12 in the entire region between the semiconductor chip 1 and the transparent substrate 7 is completely hardened by heating. A gold ball 4 connects, electrically and mechanically, an electrode pad 2 of the semiconductor chip 1 to an electrode 6 of the transparent substrate 7. The ultraviolet thermosetting resin 12 is an insulating member, so, is does not change electrical connection between the semiconductor chip 1 and the transparent substrate 7. Thus, the light coming from outside through the transparent substrate 7 enters the microlens group 3 through the follow part 13 without being hindered by the ultraviolet thermosetting resin 12.</p> |
