| 摘要 |
<p>A mounting assembly (10) for thermally coupling a heat sink to a surface mounted heat generating electronic device package (16). The mounting (10) essentially comprises a heat generating device package, a mounting attachment (18), and a heat sink. The mounting attachment and heat generating device package (16) are surface mounted to a PCB or other substrate in mutual thermal communication with a thermal pad (14) on the substrate. The mounting attachment (18) is adapted to facilitate the effective dissipation of heat from surface mounted heat generating electronic device package (16) while allowing for the post-manufacture installation and exchange of heat sinks.</p> |
