| 摘要 |
<p>PURPOSE:To contrive the improvement in mounting density by shortening a distance between semiconductor devices by fitting a projecting part of one package into a recessed part of another package and electrically connecting the external terminals for the same signals and the same source voltages of those packages with each other. CONSTITUTION:A projecting part 3a is formed on one side of a package for containing a semiconductor chip, and a recessed part 4a is formed on another side. Also, external terminals 5a which are conducted to a semiconductor chip 9 are arranged on the package planes where the projecting and recessed parts 3a and 4a are formed. Then, in this package structure, the projecting part 3a of one package is fitted into the recessed part 4a of another package, and the external terminals used for the same signals and the same source voltages can be electrically connected with each other. Accordingly, plural semiconductor devices can be electrically connected while the packages which composing each semiconductor device are in contact tightly. Thus, the intervals among the semiconductor become shorter and the mounting density can be improved.</p> |
