| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board suitable for a hybrid integrated circuit device, capable of maintaining high joining strength without generating excessive residual stress in a resin adhesive material layer for joining an insulation base body and a heat radiation plate, reducing the heat resistance, effectively dissipating generated heat from loaded electronic components, loading the respective kinds of the electronic components in high density and realizing miniaturization. SOLUTION: In a wiring board 1 for which the heat radiation plate 5 is joined to an insulation base body 3 through a resin adhesive material layer 4, the shape of a joining surface 6 of the insulation base body 3 for joining the heat radiation plate 5 to the insulation base body 3 for constituting the wiring board 1 is provided with a convex curved line part 10, whose height difference 9 is more than 50 μm and less than 10 μm in a cross-sectional shape at least from an end edge part 7 to a center part 8 on the side of the insulation base body 3 of the resin adhesive material layer 4 between the heat radiation plate 5 and the insulation base body 3. |
