| 摘要 |
A chip-size package formed using a printed circuit board, preferably comprising polyimide. The chip-size package comprises an integrated circuit chip having a plurality of peripheral bond pads. The printed circuit board has a plurality of solder bumps formed on its top surface and a plurality of bond pads around its periphery. A layer of adhesive is used to secure the printed circuit board and the integrated circuit chip together. A plurality of wire bonds electrically connected between selected bond pads of the integrated circuit chip and the printed circuit board. An encapsulant encapsulates the wire bonds and bond pads of the integrated circuit chip and the printed circuit board. |
