发明名称 LASER SUB-MOUNT
摘要 PROBLEM TO BE SOLVED: To enable a plurality of level boards which are small and provided with an isolated metal connector to be produced in high volume by a method wherein a second channel formed on the upside of a plate is made to penetrate into the plate deeper than a first channel to separate the board from the plate as a board material. SOLUTION: A channel 26 is provided in a plate formed of board material so as to extend to a selected depth. The channel 26 can be formed by sawing with a diamond saw possessed of thin edge. Thereafter, the plate is cut again, a substantial part of the base of the channel is mounted on a strip so as to provide a lateral step 24. A resultantly obtained long and narrow strip is cut, and the second cutting is carried out substantially vertical to the lateral step 24. The second cutting is extended downwards from the upside of the lateral step 24, whereby two metal contact pads are electrically isolated from each other.
申请公布号 JPH1187553(A) 申请公布日期 1999.03.30
申请号 JP19980124608 申请日期 1998.05.07
申请人 MITEL SEMICONDUCTOR AB 发明人 WICKSTROEM MIKAEL;OSKARSSON VILHELM
分类号 H05K1/02;H01L23/12;H01L33/62;H01S5/02;(IPC1-7):H01L23/12 主分类号 H05K1/02
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