| 摘要 |
<p>A thermal bonding method wherein at least two members are thermally bonded to each other with an adhesive by pressurizing and heating a laminate formed by laminating at least two members on each other via the adhesive, comprising bringing at least one member of the laminate close to a heated radiation heater and pressing the laminate in a radition heat-applied state; and a thermal bonding apparatus comprising a radiation heater, a member for supporting the laminate with at least one member thereof brought close to the radiation heater, and a pressurizing unit adapted to approach, contact and pressurize the laminate supported on the supporting member and then move away from the laminate to stop applying a pressure to the same.</p> |
