| 摘要 |
PURPOSE:To reduce malfunction due to noise and to manufacture high-speed high-reliability device by a method wherein a sub-assembly is laminated, a through-hole passing through is provided. CONSTITUTION:After a plurality of sub-assemblies 15, 16 are laminated, the surface of the substrate is connected with through-holes 17, 18 passing it. When wiring is done with, in addition to the direction of X-axis and Y-axis, u-axis and v-axis at an angle of 45 deg. combined, the sub-assembly is lamination-formed lapping power source layers 1, 3, 5 between wiring layer cores 2, 4 and front rear and wiring layer cores. After that, connection is made between the wiring layers with through-holes 17-19 passing through them. |
