发明名称 ORGANIC-INORGANIC COMPOSITE FILM WITH HIGH ADHESION STRENGTH AND METHOD FOR FORMING FILM THEREOF
摘要 PROBLEM TO BE SOLVED: To improve the adhesion strength of a coating to an electrode wiring formed on a coated film by producing a composite coating solution by mixing a resin solution containing a polyimide-type substance with a specified formula and polyimide precursor and a methaloxane polymer solution, applying the coating solution to the surface of a substrate, and thermally hardening the applied coating. SOLUTION: A resin solution is produced by dissolving polyimide precursors selected from polyimides and tetracarboxylic acids and their derivatives having the formula I and the formula II [wherein R1 , R3 , R5 , R7 respectively stand for tetravelent organic groups to compose tetracarboxylic acids or their derivatives; R2 , R6 , for divalent 6-22C organic groups having no long chain alkyl group; R4 , R8 for divalent 6-22C organic groups having long chain alkyl group; L/M = O/P = (100/0)-(70/30)]. The obtained resin solution is mixed with a methaloxane polymer solution containing a metal alkoxide having the formula III (wherein M is Si, Al or the like or Y; Z stands for the valence of the element; R9 is 1-5C alkyl) to give a composite coating solution.
申请公布号 JPH1170364(A) 申请公布日期 1999.03.16
申请号 JP19980176811 申请日期 1998.06.24
申请人 NISSAN CHEM IND LTD 发明人 HOSOYA TAKESHI;NOGAMI TATSUYA;GUNJI RIE;NAKADA TAKAKAZU;MOTOYAMA KENICHI
分类号 B05D7/24;B32B27/34;C09D179/08;C09D183/02;C09D185/00;(IPC1-7):B05D7/24 主分类号 B05D7/24
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