| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board structure and a wiring board in which no trouble arises at re-working of flip chip, etc. SOLUTION: In a wiring board structure 1, a flip chip 7 is jointed to the upper surface of a ceramics wiring board 3 via a first connection part 5 of a first solder material, a solder bump 9 of a second solder material is formed on a lower surface, and to the solder bump 9 a printed board 13 is jointed via a second connection part 11 of a third solder material. The first solder material is 90 Pb-10 Sn with a melting point A of 301 deg.C, the second solder material is a high temperature solder of 98 Pb-2 Sn with a melting point B of 322 deg.C, and the third solder material is an eutectic solder of 37Pb-63Sn with a melting point C of 183 deg.C. In short the relationship among these melting points is, melting point B > melting point A > melting point C. |
