| 摘要 |
<p>PROBLEM TO BE SOLVED: To detect the presence of wafers, having two kinds of pitches and more than three kinds of sizes by two kinds of wafer sensor devices. SOLUTION: In this device, a first wave sensor device S2 is arranged on the one side face of a column so as to be movable back and forth for a wafer carrier by a first air pressure cylinder, and a second wafer sensor device S2 is arranged on the other side face so as to be selectively stoppable at a middle position Q2 and a forward edge position Q3 for the wafer carrier by each second and third air pressure cylinder. Then, at the time of detecting the presence of a wafer W1 which is 8 inch large, the first wafer sensor device S1 is moved forward to a forward edge position Q1 , and at the time of detecting the presence of wafers W2 and W3 which are respectively 6 inch and 5 inch large, the second wafer sensor device S2 is moved forward to the middle position Q2 or the forward edge position Q3 .</p> |
