OPTICAL SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an optical semiconductor device in which plated wirings are not damaged by the tightening of a transfer molding mold. SOLUTION: A pair of through-holes 6a and 6b are formed at positions on a board 1 which are covered with a light transmitting molding unit 4. Plated wirings 2a and 2b are formed from the surface of the board 1 so as to reach the rear of the board 1 through the through-holes 6a and 6b. An optical device 3 is mounted on the plated wirings 2a in the recess 1a of the board 1 by die- bonding and connected to the plated wiring 2b by wire bonding with a gold wire 5. The light transmitting molding unit 4 is formed around the optical device 3 with light transmitting resin by transfer molding.