| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting method for a work having bumps by obtaining high reliability against thermal cycles by securing a large clearance between the work with bumps and a substrate and also by eliminating air gaps. SOLUTION: After coating a bond 4 mixed with fillers 5 on the upper surface of a substrate 1, a work 6 with bumps is mounted on the substrate 1. At this time, the fillers 5 are pressed by the bumps 7, and the fillers 5 are pushed into a solder portion 3. Next, the bond 4 is heated and hardened, and the work 6 with bumps is adhered to the substrate 1. Since the fillers 5 are interposed between electrodes 2 and the bumps 7, a clearance H between the electrodes 2 and the bumps 7 can be increase by the diameter of the fillers 5. |
