| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a chip parts manufacturing method by which lead-out electrodes can be formed on chip parts without failure at a low material cost. SOLUTION: Since lead-out electrodes 3 are formed by melting conductive wire rods provided on a porcelain substrate 1 by heating the wire rods and solidifying the molten products of the wire rods, the material cost of the electrodes 3 can be reduced, as compared with the conventional method in which the lead-out wires are formed by applying an electrode paste and hardening the applied paste and, as well as, expected lead-out electrodes can be formed superior with high accuracy by clearing off the problem of yield decline caused by defective printing.</p> |
