发明名称 COMPOSITION FOR PREVENTING CREEPING OF A FLUX FOR SOLDERING
摘要 The present invention relates to a composition for preventing creeping of a flux for soldering, which is free from a problem from the viewpoint of the global environment or working environment. The present invention provides a composition for preventing creeping of a flux for soldering, consisting of a composition comprising a polymer containing polymer units of an unsaturated ester containing a polyfluoroalkyl group, a fluorine-type surfactant and an aqueous medium. Further, the present invention provides a method for soldering by means of the composition. Furthermore, the present invention provides an electronic part or printed board soldered by the method. Still further, the present invention provides an electric appliance employing such an electronic part or printed board.
申请公布号 WO9903637(A1) 申请公布日期 1999.01.28
申请号 WO1998JP03152 申请日期 1998.07.14
申请人 SEIMI CHEMICAL CO., LTD.;KUMAI, SEISAKU;FUKATSU, YUTAKA;ODAKA, SHUNJI 发明人 KUMAI, SEISAKU;FUKATSU, YUTAKA;ODAKA, SHUNJI
分类号 B23K35/14;B23K35/22;H05K3/34 主分类号 B23K35/14
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