| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for joining substrates having bumps with improved connection reliability, cost performance, and productivity. SOLUTION: A first substrate 2 and a second substrate 3 are arranged to be separated with their bump formed surfaces 2a and 3a facing each other. A pressed body 23 harder than the bump forming material is interposed between the substrates 2, 3. The bump formed surfaces 2a and 3a of the substrate 2, 3 are pressed against the both side surfaces of the pressed body 23. Thereupon, the flattening treatment of a first bump group formed on the first substrate 2 and the flattening treatment of a second bump group formed on the second substrate 3 are carried out almost simultaneously. Then, the aligned first bumps 4 and second bumps 5 are bonded together according to flip-chip bonding process. |
