| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a multilayered wiring board which can make a semiconductor element, etc., to be driven normally by firmly connecting the active parts of the semiconductor element, etc., and passive parts of a capacitive element, resistor, etc., to bonding pads provided on organic resin insulating layers, without causing cracks, fissures, etc., in the pads. SOLUTION: In a multilayered wiring board which is constituted by alternately laminating pluralities of organic resin insulating layers 2 and thin-film wiring conductor layers 3 upon another on a substrate 1 and electrically connecting the wiring conductor layers 3 at different levels to each other through through- hole conductors 8 provided in the insulating layers 2, and then providing bonding pads 9 which are electrically connected to the wiring conductor layers 3 and to which external electronic components A are connected on the upper surface of the uppermost insulating layer 2, a filler is mixed in the insulating layers in a state such that the content of the filler in the layers gradually increases from the lowermost insulating layer 2 toward the uppermost insulating layer 2.</p> |
