Electrostatic chucks for holding substrates in process chambers

摘要

An electrostatic chuck 75 for holding a substrate 25 in a process chamber 20, comprises an electrostatic member 80 comprising an insulator having an electrode 95 therein, and a receiving surface 98 for receiving the substrate 25. A base 85 supports the electrostatic member 80, the base 85 comprises a first thermal resistance RB and has a lower surface 102. A thermal pad 100 is positioned between the receiving surface 98 of the electrostatic member 80 and the lower surface 102 of the base 85. The thermal pad 100 comprises a second thermal resistance RP that is sufficiently different from the thermal resistance RB of the base 85, to provide predetermined temperatures across a processing surface of the substrate 25 during processing in the process chamber 20.