| 摘要 |
<p>ÄObjectÜ In a liquid crystal panel substrate having a layered film structure of interlayer insulation films and metal layers alternately formed on a semiconductor substrate provided with a transistor region for pixel selection thereon, to provide a configuration for achieving a uniform polishing rate without thickening of the interlayer insulation film to be polished. ÄSolving MeansÜ A liquid crystal panel substrate is provided with a shading film 12 composed of a second metal layer in a pixel region, a second interlayer insulation film 11 under the shading film, a wiring film 10 composed of a first metal layer under the second interlayer insulation film, a pixel electrode composed of a third metal layer on a third interlayer insulation film 13 on the shading film, and a connecting plug 15 connecting the wiring film 10 and the pixel electrode through an opening provided in the shading film 12. An lower dummy pattern A composed of the first metal layer and an upper dummy pattern B composed of the second metal layer are formed on the periphery of input terminal pads 26 in the non-pixel region. Since the surface level of the third interlayer insulation film 13 formed on the dummy patterns A and B is raised, excessive polishing is prevented at the position. As a result, a uniform polishing rate is achieved in CMP treatment. <IMAGE></p> |
