| 摘要 |
PROBLEM TO BE SOLVED: To enhance the light tightness of liq. treating system regions to block dust from penetrating into the regions from other regions, thereby avoiding reduction in the yield due to deposition of foreign matters onto the wafer surface. SOLUTION: An apparatus comprise a first carrier 31 which transfers wafers W between a cassette station 10 and an interface 12 for an exposure and carries the wafers into/out of an open type treating unit group 33 including heat treating systems, and a second carrier 31 which carries the wafers into/out of resist coating units COT and developing unit DEV; the first and the second carriers are apart from each other, and extension units EXT among the treating unit group 33 in the heat treating system are used to transfer the wafers W between the first and the second carriers. |
