| 摘要 |
PROBLEM TO BE SOLVED: To facilitate the positioning of soldering by hand working, and to improve a yield rate. SOLUTION: This package of semiconductor device is provided with a plurality of wiring patterns 11 formed in such a manner that they reach the backside 1b of the package passing through the side wall surface 1s of the package from the inside of the package 1. Protruding parts 21 are formed on the position where the wiring patterns 11 are provided on the backside 1b of the package, and wiring patterns 11 are formed covering the protruding parts 21. Said protruding parts 21 are provided corresponding to the arrangement of the holes provided on the substrate where the package 1 of the semiconductor device is mounted. |
