GRINDING WHEEL FOR POLISHING LSI METAL WIRING AND POLISHING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To accomplish global flatness of LSI metal wiring by polishing it with a grinding wheel containing abrasive grains of special material including excellent polishing performance regarding the LSI metal wiring grinding wheel applied for LSI global planarization and the LSI metal wiring polishing method. SOLUTION: A grinding wheel is composed to contain an MnO2 powder of an average grain diameter of less than 1μm but 0.01μm or more as abrasive grains or at least one kind or more of either Al2 O3 powder or an SiC powder of an average grain diameter of less than 1μm but 0.01μm or more as abrasive grains and polishing is performed by using this grinding wheel. The filling rate of the abrasive grain in this LSI metal wiring grinding wheel is preferable to be 50 to 95 volume %. It may also be used as a resinoid bond grinding wheel solidified after mixing the abrasive grains and the resinoid bond together and forming it.